Polyamide Hot-Melt Adhesive
Low-viscosity dimer-acid polyamide hot melt with high bond strength for electronics, footwear and leather.
Specifications
Technical specifications.
| Reference | CAS 25587-80-8 |
| Softening point (R&B) | 110–120 ℃ |
| Viscosity (25℃) | 150–350 mPa·s |
| Acid value | ≤ 6 mgKOH/g |
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Brand overview
· Zanyu Technology 赞宇科技 · Oleochemicals